563 Mp4
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563 mp4
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The ARM Mali-G51 MP4 is an integrated mid-range graphics card for ARM based SoCs (mostly Android based). It was introduced mid 2018 in the HiSilicon Kirin 710 and uses 4 clusters (hence the MP4name).
The ARM Mali-G77MP9 is an integrated high-end graphics card for ARM based SoCs (mostly Android based). It was introduced early 2020 in the Mediatek Dimensity 1000 (and 1000+). It integrates 9 of the 16 possible cores and is based on the Valhal architecture. According to ARM it offers improvements in the machine learning efficiency (+60%), a 30% improved performance and a 30% improved efficiency compared to the previous generation (G76).
After going through the source and checking how the format-detection works, I saw that CCE is checking the video for certain strings to determine the format, at least that's how I understood it.I opened the TS-file in a hex-editor and searched for moov:Position 727131 0xB185B
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SEM images of copper surfaces after beingimmersed in 2.5 M NaOHand 0.1 M (NH4)2S2O8 at4 C for 1 h, followed by drying at 180 C for 2 h and thentreatment with FAS17 for 1 h. (b) Magnified view of (a). The insetshows the profiles of the 4 μL sessile water droplet with CAat 160.
Time-lapse optical images(top-view) of vapor condensation on thehorizontally placed copper SHS without silica particles at (a) 33s, (b) 36 s, (c) 39 s, and (d) 40 s. The surface temperature is 0C, and the ambient RH is 96 1% (26 1 C).The coalescence and spontaneous motion of condensate droplets areobvious. The scale bar is 100 μm.
In our previous studies,14,15 we speculated and indirectlydemonstrated the microscopic mechanism of the Cassie condensationon the SHS, i.e., nucleation occurs at the top, side, and bottom ofthe nanostructures at the early beginning of vapor condensation. Ata slightly later stage, the growth of the droplet is dominated bycontinuous vapor condensation and droplet coalescence until the gapsare filled. Subsequently, a Wenzel droplet, covering more than onegap with an external and relatively flat surface, forms. Finally,the Laplace pressure caused by the interconnected and hydrophobicnarrow gaps forces the Wenzel droplets to ascend and rapidly becomeCassie droplets. It is the coalescence between the Cassie dropletsthat initiates the jumping phenomenon. However, as the droplets formedduring the Wenzel-to-Cassie transition are so small, it is extremelydifficult to observe them directly.
Time-lapse optical images(top-view) of vapor condensation on thehorizontally placed copper SHS, followed by the deposition of silicaparticles with diameters of 100 nm (a), 300 nm (b), and 1 μm(c). The surface temperature is 0 C, and the ambient RH is 961%(T = 26 1 C). The coalescence and spontaneous motionof condensate droplets are obvious. The scale bar is 75 μm.
SEM of the copper SHSbeing filled with SiO2 nanoparticles(diameter 100 nm) before (a, b) and after 1 h of Cassie condensation(c, d) or 1 h of water rinsing (e, f). The SHS temperature is 0 C,and the ambient RH is 67 1% (T = 23 1 C).
Self-cleaning mechanism of the silica nano- and microparticleswith diameters significantly smaller (a), comparable to (b), and significantlylarger (c) than the width of the nanogaps of the SHS. Only particleswith diameters smaller or larger than the width of the nanogaps ofthe SHS could be removed by jumping condensates. The particles withdiameters comparable to the width of the nanogaps of the SHS are mostlylocked by the nanoribbons.
Recently, Gao et al.30 fabricated asuperhydrophobic surface with spatially heterogeneously patternedsuperhydrophilic microdots by a mask-assisted photodegradation method.Based on such a novel surface, they realized confined growth, moreefficient coalescence, and self-ejection of condensate droplets. Inour study here, during vapor condensation nucleation, the hydrophilicsilica nanoparticles deposited on the copper SHS play the same roleas superhydrophilic microdots in the work of Gao et al.30 The difference is that the hydrophilic particleswere finally removed away from the SHS, while the superhydrophilicmicrodots could not be removed away.
SEM of the copper SHSbeing filled with SiO2 nanoparticles(diameter 300 nm) before (a, b) and after 2.5 h of Cassie condensation(c, d) or rinsing with water for 1 h (e, f). The SHS temperature is0 C, and the ambient RH is 67 1% (T =23 1 C).
SEM of the copper SHS being filled withSiO2 nanoparticles(diameter 1 μm) before (a) and after 1 h of Cassie condensation(b), 2.5 h of Cassie condensation (c), or 1 h of water rinsing (d).The SHS temperature is 0 C, and the ambient RH is 67 1% (T = 23 1 C).
SEM of the copper SHS being filled with SiO2 nanoparticles(diameter 100 nm) before (a, b) and after 1 h of Cassie condensationvertically (c, d) and horizontally (e, f). The SHS temperature is0 C, and the ambient RH is 65 1% (T =26 1 C).
SEM of the copper SHS being filled with SiO2 nanoparticles(diameter 1 μm) before (a, b) and after 1 h of Cassie condensationvertically (c, d) or horizontally (e, f). The SHS temperature is 0C, and the ambient RH is 65 1% (T =26 1 C).
In 2018, Zhang et al.20 fabricated SHSswith nanopore structures on glass and then investigated particle removalbehavior from the SHSs via jumping condensate for different particlenumbers and sizes. They find that smaller particles, which could notbe removed by the action of vibration, gravity, and wind, can be removedaway via the self-jumping of water droplets. However, the particlesthey adopted are much larger than the width of nanogaps on the SHSs.Ding et al.21 fabricated hydrophilic, hydrophobic,and SH coatings on copper and studied the effect of the surface wettabilityon dust removal by condensate water. They found that the remnant dustweight on the SH surface is 69.9% lower than that on the uncoatedsurface, 61.1% lower than that on the hydrophilic surface, and only3.59% lower than that on the hydrophobic surface. This means thatthe SH has no obvious advantage in antisoiling by condensate water.Moreover, they seem to omit studying the relationship between thediameter of dust particles and the SH characteristic morphology.
Lyons et al.32 think that condensationexacerbates soiling rates and leads to stronger adhesion, which makescleaning more expensive. They found that hydrophobic and SH-coatedglass exhibited 42% lower soiling rates than hydrophilic and bareglass in the presence of condensed water. The hydrophobic surfaceswere also easier to clean using only water. Huang et al.33 prepared an SHS and deposited dust on it. Theystudied the dust removal process on a condensation visualization platformand found the removal included three consecutive processes, e.g.,dust agglomerating, condensate sliding, and rolling with jumping condensate.Over 95% of particles can be removed by condensation within 90 mincondensation. However, the dust they used is far larger than the widthof nanogaps on the SHS.
The authors gratefully acknowledge financial supportfromthe National Natural Science Foundation of China (Nos. 51172206 and52173085) and the Zhejiang Provincial Natural Science Foundation ofChina (No. LQ18E010005). 041b061a72